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凯发国际真人的产品中心
贴片自恢复保险丝smd2018
performance specification
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model |
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maximum |
resistance |
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v max |
imax |
i hold |
i trip |
pd |
time to trip |
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marking |
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@25°c |
@25°c |
typ. |
current |
time |
r i min |
r1max |
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(v dc) |
(a) |
(a) |
(a) |
(w) |
(a) |
(sec) |
(w) |
(w) |
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smd2018-030sf |
030 |
60 |
10 |
0.30 |
0.60 |
0.9 |
1.5 |
3.00 |
0.500 |
2.300 |
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smd2018-050sf |
050 |
60 |
10 |
0.55 |
1.20 |
1.0 |
2.5 |
3.00 |
0.200 |
1.000 |
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smd2018-075sf |
075 |
60 |
10 |
0.75 |
1.50 |
1.1 |
8.0 |
0.30 |
0.110 |
0.630 |
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smd2018-100sf |
100 |
15 |
35 |
1.10 |
2.20 |
1.1 |
8.0 |
0.40 |
0.060 |
0.360 |
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smd2018-100sf33v |
100 |
33 |
35 |
1.10 |
2.20 |
1.1 |
8.0 |
0.40 |
0.060 |
0.360 |
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smd2018-150sf |
150 |
15 |
35 |
1.50 |
3.00 |
1.1 |
8.0 |
0.80 |
0.050 |
0.170 |
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smd2018-200sf |
200 |
10 |
35 |
2.00 |
4.00 |
1.1 |
8.0 |
2.40 |
0.030 |
0.100 |
v max = maximum operating voltage device can withstand without damage at rated current (imax).
i max = maximum fault current device can withstand without damage at rated voltage (v max).
i hold = hold current. maximum current device will not trip in 25°c still air.
i trip = trip current. minimum current at which the device will always trip in 25°c still air.
pd = power dissipation when device is in the tripped state in 25°c still air environment at rated voltage.
ri min/max = minimum/maximum device resistance prior to tripping at 25°c.
r1max = maximum device resistance is measured one hour post reflow.
caution : operation beyond the specified ratings may result in damage and possible arcing and flame.
environmental specifications
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test |
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conditions |
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resistance change |
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passive aging |
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85°c, 1000 hrs. |
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i hold/i trip pass |
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humidity aging |
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85°c, 85% r.h. , 168 hours |
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i hold/i trip pass |
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thermal shock |
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85°c to -40°c, 20 times |
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i hold/i trip pass |
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resistance to solvent |
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mil-std-202,method 215 |
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电阻不變化 |
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vibration |
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mil-std-202,method 201 |
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电阻不變化 |
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ambient operating conditions : - 40 °c to 85 °c |
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maximum surface temperature of the device in the tripped state is 125 °c |
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thermal derading chart
recommended hold current(a) at ambient temperature(°c)
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model |
ambient operation temperature |
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-40°c |
-20°c |
0°c |
25°c |
40°c |
50°c |
60°c |
70°c |
85°c |
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smd2018-030sf |
0.48 |
0.42 |
0.35 |
0.30 |
0.24 |
0.21 |
0.17 |
0.15 |
0.10 |
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smd2018-050sf |
0.87 |
0.77 |
0.67 |
0.55 |
0.46 |
0.41 |
0.36 |
0.31 |
0.23 |
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smd2018-075sf |
1.19 |
1.05 |
0.91 |
0.75 |
0.61 |
0.54 |
0.47 |
0.41 |
0.32 |
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smd2018-100sf |
1.71 |
1.52 |
1.32 |
1.10 |
0.94 |
0.84 |
0.74 |
0.64 |
0.50 |
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smd2018-150sf |
2.38 |
2.10 |
1.82 |
1.50 |
1.27 |
1.13 |
0.99 |
0.85 |
0.64 |
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smd2018-200sf |
2.95 |
2.65 |
2.35 |
2.00 |
1.74 |
1.59 |
1.44 |
1.29 |
1.06 |
thermal derating curve
average time-current curve
soldering parameters
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profile feature |
pb-free assembly |
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average ramp-up rate(ts max to t p) |
3℃/second mac. |
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preheat -temperature min(ts min) -temperature max(ts max) -time(ts min to ts max) |
150℃ 200℃ 60~180 seconds |
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time maintained above: -temperature(tl) -time(tl) |
217℃ 60~150 seconds |
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peak temperature(tp) |
260℃ |
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ramp-down rate |
6℃/second max. |
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time 25℃ to peak temperature |
8 minutes max |
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storage condition |
0℃~30℃,30%~60%rh |
recommended maximum paste thickness is 0.25mm
devices can be cleaned using standard industry methods and solvents.
note 1:all temperature refer to topside of the package, measured on the package body surface.
note 2: if reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
physical dimensions(mm.)
|
model |
a |
b |
c |
d |
e |
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min. |
max. |
min. |
max. |
min. |
max. |
min. |
min. |
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smd2018- |
4.72 |
5.44 |
4.22 |
4.93 |
0.50 |
1.20 |
0.30 |
0.25 |
termination pad characteristics
terminal pad materials：tin-plated nickel-copper
terminal pad solder ability：meets eia specification rs186-9e and ansi/j-std-002 category 3.
recommended pad layout (mm.)
注：在此印锡面积条件下，推荐钢网厚度为≧0.12mm(钢网厚度不够要增大刷锡面积）
packaging quantity
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part number |
quantity |
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smd2018-0100sf33v |
2500 pcs/reel |
tape & reel packaging per eia481-1
tape and reel specifications (mm)
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注意事项
pptc使用注意事项：
·pptc为热敏元件，对环境温度比较敏感，建议在pptc周围不要设计热源元件，尽量减少外部热源的影响。
·请在规格书规定的参数下(<10%)使用，超出电压电流规格值，会导致pptc出现电弧，阻值升高，甚至烧片。
·规格书的电气特性，均是基于在大容指定测试板经过一次回流焊之后的测试；如果客户有二次回流焊或者注塑点胶等其他热工序，会对上述参数有一定程度的衰减，需要验证其适用性。
·pptc贴片产品是为smt工艺设计的封装形式，焊接工艺为回流焊；要求客户遵守我们推荐的焊盘布局和回流焊配置文件。不正确的电路板布局或回流配置可能会对pptc的可焊性性能产生负面影响。焊接工艺可参考大容推荐的回流焊曲线。如果回流焊温度超过推荐的值，pptc将有可能受到损伤。使用手工焊及波峰焊接pptc可能会导致产品焊后电阻超出规格。
·某些注塑料、单组份、双组份固化胶粘剂、硅胶、侵蚀性溶剂污染pptc材料破坏芯片，需要对注塑料胶料等材料牌号以及应用参数（如温度、时间等）进行验证，以确保产品及工艺的匹配性，确认不会影响pptc性能之后方可使用。pptc在充电线端应用中，建议使用pp类材料做内膜，禁止使用tpe类与pvc类等材料做内膜。
·pptc贴装或使用过程中，不建议使用洗板水或其他清洗剂进行清洗。如必须使用，需要验证各类清洗剂、洗板水以及溶剂的适用性，确认不会影响pptc性能之后方可使用。已知对pptc有影响的化学药品包括但不于醚类、苯类、酮类以及脂类等较强溶解性、破坏性的有机化合物，清洗后将产品放置于敞开的环境中至少24小时，将残留的溶剂进行充分的挥发。
·装配过程中，避免用暴力砸、挤、压、拉、扭、刺等方式作用pptc本体，以免引起pptc 性能衰减。
·pptc元件是为电路中偶尔出现的过流而设计的，不建议用在连续且持续过流的电路中。
·大容smd pptc湿敏等级为2级，为密封包装。客户如在库存中发现有包装破损的，立即将产品隔离处理；使用时如有余料，需恢复之前包装状态，做密封保存，否则会影响产品性能导致焊后电阻越规格。
·产品废弃时，可按照一般电子废弃物处理，具体材料组成可参见msds
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